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Package Matters, by Javier DeLaCruz, eSilicon's manufacturing technology director, covers hot topics in semiconductor packaging such as 3D-IC and 2.5D-IC packaging technology, thru-silicon-vias (TSVs), the relative cost of multi-chip modules (MCMs), and considerations for choosing the lowest-cost package for your ASIC. [Read More]

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eSilicon Blogs

The Way IC It

My perspective on the semiconductor business

The Way IC It by eSilicon CEO Jack Harding, delivers Harding's view on current events in the semiconductor industry, including custom memory IP vs. standard memory IP, long-term fallout from the crisis in Japan, and the disaggregation and reintegration of the supply chain. [Read more]

Package Matters

From die floorplanning to system integration: the ecosystem of the package

Package Matters, by Javier DeLaCruz, eSilicon's manufacturing technology director, covers hot topics in semiconductor packaging such as 3D-IC and 2.5D-IC packaging, thru-silicon-vias (TSVs), multi-chip modules (MCMs), and how to choose the lowest-cost ASIC package. [Read more]

The Way IC It

The Way IC It is written by CEO Jack Harding. Harding is responsible for eSilicon’s overall leadership, strategy and management. Harding brings more than 25 years of management experience in the semiconductor industry, spanning the EDA and IC sectors. Prior to co-founding eSilicon in 2000, he was the president and CEO of Cadence Design Systems. During his tenure at Cadence the company was the world’s largest supplier of electronics design software and provided the greatest shareholder value in the history of the company. [Read more]

Package Matters

Package Matters is written by Javier DeLaCruz, the manufacturing technology director at eSilicon Corporation. He is responsible for all package engineering activities including design, package selection, electrical extraction and simulation, co-design activities with the physical design teams, and system-level integration. [Read more]